JPS6217380B2 - - Google Patents
Info
- Publication number
- JPS6217380B2 JPS6217380B2 JP3714679A JP3714679A JPS6217380B2 JP S6217380 B2 JPS6217380 B2 JP S6217380B2 JP 3714679 A JP3714679 A JP 3714679A JP 3714679 A JP3714679 A JP 3714679A JP S6217380 B2 JPS6217380 B2 JP S6217380B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- power diode
- semiconductor element
- sleeve
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Synchronous Machinery (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7809329A FR2421465A1 (fr) | 1978-03-30 | 1978-03-30 | Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54152475A JPS54152475A (en) | 1979-11-30 |
JPS6217380B2 true JPS6217380B2 (en]) | 1987-04-17 |
Family
ID=9206456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3714679A Granted JPS54152475A (en) | 1978-03-30 | 1979-03-30 | Semiconductor element power diode |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS54152475A (en]) |
DE (1) | DE2912189C2 (en]) |
FR (1) | FR2421465A1 (en]) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3124692A1 (de) * | 1981-06-24 | 1983-01-13 | Robert Bosch Gmbh, 7000 Stuttgart | "halbleitergleichrichter" |
US4792204A (en) * | 1987-06-08 | 1988-12-20 | Siemens Aktiengesellschaft | Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment |
US4938054A (en) * | 1989-05-03 | 1990-07-03 | Gilbarco Inc. | Ultrasonic linear meter sensor for positive displacement meter |
DE10141603A1 (de) * | 2001-08-24 | 2003-03-06 | Bosch Gmbh Robert | Verfahren zum Befestigen eines elektrischen Elements sowie Baueinheit mit danach befestigtem elektrischen Element |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1188210B (de) * | 1962-05-28 | 1965-03-04 | Siemens Ag | Halbleiterbauelement |
DE1489688A1 (de) * | 1965-06-26 | 1969-12-11 | Bosch Gmbh Robert | Halbleiterbauelement |
DE1564749A1 (de) * | 1966-10-27 | 1970-01-08 | Semikron Gleichrichterbau | Halbleiteranordnung |
DE1614481A1 (de) * | 1967-04-03 | 1970-07-02 | Siemens Ag | Halbleiterbauelement |
US3527971A (en) * | 1968-05-08 | 1970-09-08 | Applied Motors Inc | Apparatus for mounting brushes and diodes in a dynamoelectric machine |
DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
GB1489603A (en) * | 1974-01-18 | 1977-10-26 | Lucas Electrical Ltd | Semi-conductor assemblies |
-
1978
- 1978-03-30 FR FR7809329A patent/FR2421465A1/fr active Granted
-
1979
- 1979-03-28 DE DE19792912189 patent/DE2912189C2/de not_active Expired
- 1979-03-30 JP JP3714679A patent/JPS54152475A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2421465B1 (en]) | 1982-07-23 |
DE2912189C2 (de) | 1984-12-13 |
JPS54152475A (en) | 1979-11-30 |
FR2421465A1 (fr) | 1979-10-26 |
DE2912189A1 (de) | 1979-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5005069A (en) | Rectifier and method | |
US4107727A (en) | Resin sealed semiconductor device | |
US12003148B2 (en) | Rotary electric machine and manufacturing method for rotary electric machine | |
US4538168A (en) | High power semiconductor package | |
CN1879212B (zh) | 二极管 | |
JPH0376026B2 (en]) | ||
JPS6217380B2 (en]) | ||
US3178621A (en) | Sealed housing for electronic elements | |
US4007477A (en) | Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink | |
JP3668904B2 (ja) | 内燃機関用点火装置 | |
JP2813621B2 (ja) | ねじ締めコネクタの製造方法 | |
JPS6321340B2 (en]) | ||
US20020047357A1 (en) | Support plinth for a power diode in a motor vehicle alternator | |
JPS5915237Y2 (ja) | モ−タのブラシホルダステ− | |
JPH01147837A (ja) | 半導体装置 | |
JP4260760B2 (ja) | 内燃機関用点火装置 | |
JPH0412677Y2 (en]) | ||
JPH0227558Y2 (en]) | ||
JP2678116B2 (ja) | 熱感知器及びその製造方法 | |
JP2865196B2 (ja) | 半導体装置 | |
JPS5982755A (ja) | 半導体装置 | |
JPS6336689Y2 (en]) | ||
US3441657A (en) | Semiconductor lead assemblies | |
JPH03132098A (ja) | ハイブリッド回路装置 | |
JP2587843Y2 (ja) | 電解コンデンサ |